ιστολόγιο περίπου Ziitek's TIG 7835L liquid metal heat conductive material efficiently dissipates heat for AI server

Ziitek's TIG^®7835L liquid metal thermal conductive material empowers AI servers with ultra-high computing power and efficient heat dissipation

1. When computing power surges but heat dissipation becomes a bottleneck, liquid metal becomes the core solution to break through the problem.

The rapid development of the artificial intelligence industry has led to the continuous increase in power consumption of high-performance processors, AI acceleration chips, and GPUs. The integration density of chips continues to rise, and the heat flux density is increasing exponentially. Traditional thermal conductive pastes and thermal pads have limited thermal conductivity and are prone to drying out and rising thermal resistance when operating at full load for a long time, directly causing the equipment to overheat and reduce computing power, shortening the lifespan of the server, and becoming a key bottleneck for the efficient operation of data centers.

Ziitek has been deeply engaged in the field of thermal management materials for many years. It independently developed TIG^®7835L gallium-based liquid metal thermal conductive material, relying on mature alloying and patented packaging technology, to create an efficient bottom-level heat dissipation solution specifically for AI servers and high-power computing equipment, perfectly meeting the continuous full-load operation requirements of high-power chips.

2. Core performance of TIG^®7835L, matching the strict conditions of AI servers

TIG^®7835L is a silver-white gallium alloy liquid material that remains in a liquid state without the need for high-temperature heating. Its core thermal conductivity can reach 35.0W/m·K, far exceeding the thermal conductivity of conventional thermal conductive media. The material's viscosity is lower than 10mPa·s, with excellent fluidity, which can completely fill the tiny concave and convex contact surfaces between the chip and the heat sink, minimizing interface thermal resistance and quickly conducting the concentrated heat from the AI chip.

The product's chemical stability is outstanding, with low volatility and extremely low loss. The working temperature range covers -40℃ to 250℃, capable of coping with complex environments such as continuous full-load operation of servers and temperature fluctuations in the data center. The raw materials are safe and non-toxic, fully meeting RoHS environmental standards; the density, specific heat capacity, and resistivity of the material have undergone standardized testing, with no significant degradation in long-term use performance, significantly reducing the maintenance cost of the equipment.

To address the common concerns of leakage and short-circuit risks, Ziitek has paired it with the patented CN224218815U packaging structure, using Z-FOAM^® special micro-porous foam frame sealing. The foam quickly rebounds under pressure and can withstand long-term compression loads, not only locking the liquid metal to prevent leakage but also providing a buffering and noise reduction effect, optimizing the operating environment of the server as a whole.

3. Suitable for multiple scenarios of computing power equipment, standardized use is more convenient

In addition to core AI servers, AI chips, and high-performance GPUs, TIG^®7835L can also be widely used in graphics processing chips, laptops, LED devices, industrial liquid cooling heat dissipation modules, and other products, suitable for diversified high-power heat dissipation scenarios. The product is available in 1ml, 30ml, and 50ml syringe specifications, catering to both R&D prototyping and large-scale mass production delivery.

The complete operation procedures include: ensuring the contact surface is clean and dry before application, leaving it to stand at room temperature for 4 hours before application; the liquid metal is conductive and needs to be isolated from the circuit board to avoid short circuits; the material will corrode aluminum parts, so they need to be pre-treated with anode protection, and the edges are surrounded and fixed with the matching foam to prevent diffusion. The material should be used up within 3 days after opening and stored in a low-temperature, dry environment to maintain its complete performance.

4. Ziitek's global technical services, solving computing power heat dissipation problems in one step

As a professional thermal management material brand, Ziitek has established a global local service system. In China, it has set up an exclusive technical service hotline, and in Canada, Vietnam, Taiwan of China, and other regions, it has configured service channels to quickly respond to customized heat dissipation requirements of server manufacturers and provide full-process support for material selection, process guidance, and heat dissipation scheme optimization. In response to the escalating heat dissipation demands in the era of AI computing power, Ziitek has continuously refined its liquid metal new material technology. With the stable and reliable thermal conductivity performance of TIG^®7835L and the safe and controllable packaging structure, it has laid a solid foundation for heat dissipation for data center AI servers, helping the industry achieve long-term and stable output of computing power.