Not just about sealing and shock absorption: Unleash the "heat-conducting" new capabilities of the silicone foam!

In today's pursuit of lightweight and high-performance devices, the cooling space is constantly being compressed, and heat has become the number one enemy. Are you still struggling to find a multifunctional material that can effectively buffer and conduct heat? It's time to refresh your understanding of traditional materials! The familiar "all-rounder" - silicone foam, has quietly mastered its 【heat conduction】 skills. We are familiar with its softness and elasticity, and are amazed by its sealing and shock absorption properties. But you may not know that through innovative material science and technology, we have successfully distributed high-conductivity fillers evenly in the micro-porous structure of silicone foam.

This represents a transformation: The era of simple physical protection has come to an end, and the era of intelligent thermal management is about to arrive.

This brand-new thermal conductive silicone foam no longer acts as an "insulator" of heat, but has become a "transporter" of heat. By leveraging its extensive microporous surface area, it uses both thermal conduction and air convection pathways to rapidly spread and disperse the heat from heat-generating components such as chips and batteries in a lateral manner, effectively reducing the temperature at hotspots and enhancing the stability and lifespan of the equipment.

Imagine that your product becomes:
In 5G communication devices, it is closely attached to the chip, serving as both a shock absorber and a heat sink, continuously cooling down the powerful computing power.
Inside the battery pack of new energy vehicles, it is placed between the cells, effectively balancing the requirements for physical buffering, insulation, fire prevention and thermal management.
In ultra-thin laptops, it fills the gap between the motherboard and the casing, quickly directing the heat to the metal casing, silently solving the problem of heat dissipation.
In the unmanned aircraft flight control system, it not only withstands flight vibrations but also ensures that the core processor operates effectively at low temperatures.

In summary: It remains the reliable expert in sealing and shock absorption; but now, it has also become an invisible heat dissipation master. Saying goodbye to the cumbersome design of multiple layers of materials, it solves multiple problems with a single material.