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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

Κίνα Dongguan Ziitek Electronic Materials & Technology Ltd. Πιστοποιήσεις
Κίνα Dongguan Ziitek Electronic Materials & Technology Ltd. Πιστοποιήσεις
Το θερμικό αγώγιμο μαξιλάρι κοιτάζει και λειτουργεί πολύ καλό. Δεν έχουμε καμία ανάγκη για άλλο θερμικό αγώγιμο μαξιλάρι τώρα!

—— Peter Goolsby

Είχα συνεργαστεί με Ziitek για 2 έτη, παρείχαν υψηλό - τα ποιοτικά θερμικά αγώγιμα υλικά, και η παράδοση εγκαίρως, συστήνουν τα αλλαγή φάσης υλικά τους

—— Antonello Sau

Καλή ποιότητα, καλή υπηρεσία. Η ομάδα σας μας δίνει πάντα τη βοήθεια και την επίλυση, ελπίδα που θα είμαστε καλός συνεργάτης όλη την ώρα!

—— Chris Rogers

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2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

Μεγάλες Εικόνας :  2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

Λεπτομέρειες:
Place of Origin: China
Μάρκα: ZIITEK
Πιστοποίηση: UL and RoHs
Model Number: TIF540BS
Πληρωμής & Αποστολής Όροι:
Minimum Order Quantity: 1000pcs
Τιμή: Διαπραγματεύσιμα
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Λεπτομερής Περιγραφή Προϊόντος
Products name: 2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD Continuos Use Temp: -45℃ to 200℃
Keywords: Thermal Gap Pad Density: 3.0g/cc
Hardness: 13 Shore 00 Color: Blue
Thermal conductivity& Compostion: 2.6W/m-K Thickness: 1.0mmT
Construction: Ceramic filled silicone elastomer Application: CPU/LED/PCB/GPU/SSD

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD

 

TIFTM540BS use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:

> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating

> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating

 

Applications
> Cooling components to the
> chassis of frame
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light

Typical Properties of TIFTM540BS
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 3.0g/cc ASTM D297
Thickness range 1.0mmT ASTM C351
Hardness 13 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -45 ~200℃ *******
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity ≥2.0X1013Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 2.6W/mK ASTM D5470

 

Product Specifications
Standard Thickness:

0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

 

Standard Size:

8"X16"(203 mm×406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.

For other thicknesses or moreinformation. please contact us.

2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronic Materials & Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: 18153789196

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