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Products name: | Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll | Hardness: | 45±5 Shore 00 |
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Keywords: | Thermal Pad In Roll | Thermal conductivity& Compostion: | 8.0 W/m-K |
Specific Gravity: | 3.5g/cc | Thickness: | 1.5mmT |
Color: | Gray | Continuos Use Temp: | -45℃ to 200℃ |
Construction: | Ceramic filled silicone elastomer |
Heat Dissipation Silicone Pad Air Gap Filler Thermal Pad 1.5mm Thermal Transfer Extreme Thermal Pad In Roll
The TIF760HQ is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive:8.0W/MK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> Heat pipe thermal solutions
> Memory Modules
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
> Monitoring the Power Box
Typical Properties of TIF760QE Series | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Specific Gravity | 3.5g/cc | ASTM D297 |
thickness | 1.5mmT | ASTM D374 |
Hardness (thickness<1.0mm) | 55±5 (Shore 00) | ASTM 2240 |
Hardness (thickness≥ 1.0mm) | 45±5 (Shore 00) | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
Dielectric Constant | 5.0MHz | ASTM D150 |
Volume Resistivity | 1.0X10¹²Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 8.0W/m-K | ASTM D5470 |
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Υπεύθυνος Επικοινωνίας: Dana Dai
Τηλ.:: 18153789196