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Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Κίνα Dongguan Ziitek Electronic Materials & Technology Ltd. Πιστοποιήσεις
Κίνα Dongguan Ziitek Electronic Materials & Technology Ltd. Πιστοποιήσεις
Το θερμικό αγώγιμο μαξιλάρι κοιτάζει και λειτουργεί πολύ καλό. Δεν έχουμε καμία ανάγκη για άλλο θερμικό αγώγιμο μαξιλάρι τώρα!

—— Peter Goolsby

Είχα συνεργαστεί με Ziitek για 2 έτη, παρείχαν υψηλό - τα ποιοτικά θερμικά αγώγιμα υλικά, και η παράδοση εγκαίρως, συστήνουν τα αλλαγή φάσης υλικά τους

—— Antonello Sau

Καλή ποιότητα, καλή υπηρεσία. Η ομάδα σας μας δίνει πάντα τη βοήθεια και την επίλυση, ελπίδα που θα είμαστε καλός συνεργάτης όλη την ώρα!

—— Chris Rogers

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Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Μεγάλες Εικόνας :  Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

Λεπτομέρειες:
Τόπος καταγωγής: Κίνα
Μάρκα: ZIITEK
Πιστοποίηση: UL and RoHs
Αριθμό μοντέλου: TIF100-50-11U
Πληρωμής & Αποστολής Όροι:
Ποσότητα παραγγελίας min: 1000 τεμ
Τιμή: Διαπραγματεύσιμα
Συσκευασία λεπτομέρειες: 1000 ΤΕΜ/ΤΣΑΝΤΑ
Χρόνος παράδοσης: 3-5 εργάσιμες
Όροι πληρωμής: T/T
Δυνατότητα προσφοράς: 100000 τμχ/ημέρα
Λεπτομερής Περιγραφή Προϊόντος
Όνομα προϊόντος: Εξαιρετικά μαλακά θερμικά υλικά PAD με βάση σιλικόνη για διακομιστές AI επεξεργαστών AI Θερμική αγωγιμότητα: 5.0W/m-Κ
Λέξεις-κλειδιά: Υλικά Thermal GAP PAD Βαθμολογία φλόγας: UL 94 V-0
Εφαρμογή: AI Processors Διακομιστές AI Σκληρότητα: 27 Shore 00
Συνεχής Χρήση Θερμ: -40 σε 200℃ Ειδικό Βάρος: 3.4g/cc
Κατασκευή: Κεραμικό ελαστομερές σιλικόνης

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers

 

TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Application:


Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.

 

Typical Properties of The TIF®100-50-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Στοιχεία επικοινωνίας
Dongguan Ziitek Electronic Materials & Technology Ltd.

Υπεύθυνος Επικοινωνίας: Dana Dai

Τηλ.:: 18153789196

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