Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Products description

The TIF^®100-50-11F  Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.

Features:

>  Good thermal conductive: 5.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  RoHS compliant
>  UL recognized

Applications:

>  Mainboard/mother board
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Automotive electronics
>  New energy vehicle
>  Motherboard chip
>  Radiator
>  AI Processors AI Servers