High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

High Thermal Conductivity 16W/mK Thermal Conductive Pad Silicone Material For GPU CPU Heatsink AI Servers Cooling Applications

Products description 

The TIF^®800TS Series is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical _strength and compressibility, making it easy, to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.

Features: 
 
> Excellent thermal conductivity: 16.0W/mK 
> Good softness and filling properties
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Applications: 

> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> AI Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations